To provide an accurate and rapid quotation, standard Gerber files (RS-274X format), a comprehensive Bill of Materials (BOM) including part numbers and manufacturer specifications, pick-and-place coordinate data, and any specific assembly or testing guidelines are required.
Production lines support ultra-fine pitch components, 01005 passives, multi-layer BGA/uBGA with automated X-ray inspection (AXI), QFNs, and dual-sided SMT reflow, alongside wave soldering and selective soldering for through-hole parts.
Yes, turnkey solutions cover the complete project lifecycle: raw PCB manufacturing, global component procurement, precision SMT assembly, firmware flashing, conformal coating, functional box build, and final logistics.
Strict multi-stage quality control is implemented, featuring Automated Optical Inspection (AOI), In-Circuit Testing (ICT), functional testing (FCT), thermal stress screening, and compliance with IPC-A-610 standards to guarantee stability under demanding conditions.
Rapid engineering prototyping verifies Design for Manufacturability (DFM) and Design for Testing (DFT) early on, allowing effortless transitions from small proof-of-concept batches to mass industrial-scale production runs.