OEM (Original Equipment Manufacturer) services build printed circuit board assemblies precisely according to your complete design and engineering specifications. ODM (Original Design Manufacturer) services cover both the design development and production phases, turning functional concepts into finished, production-ready boards.
One-stop manufacturing encompasses bare PCB fabrication, component sourcing, SMT surface mounting, DIP through-hole insertion, soldering, firmware programming, functional testing, and final quality control packaging.
Yes. Production facilities feature automated high-speed SMT lines for fine-pitch microcomponents alongside dedicated DIP lines with wave soldering and selective soldering for heavy-duty connectors, relays, and power electronics.
Standard quality protocols include Automated Optical Inspection (AOI), X-ray inspection for BGA and leadless packages, In-Circuit Testing (ICT), Functional Circuit Testing (FCT), and burn-in testing to verify electronic reliability under operating conditions.
A complete quote requires Gerber files (RS-274X format), a detailed Bill of Materials (BOM) listing manufacturer part numbers and reference designators, assembly pick-and-place (Centroid) data, and any specific testing instructions.
Yes. Assemblies engineered for industrial control and IoT devices utilize conformal coating, high-reliability solder alloys, and rigorous thermal testing to withstand harsh environments, electromagnetic noise, and extended operational lifecycles.