Engineered for high thermal endurance, tropicalized humidity resistance, and turn-key manufacturing excellence from prototype to mass rollout.
Strategic geographic location along critical Indian Ocean maritime corridors positions Sri Lanka as a high-potential node for IoT, smart logistics, apparel tech, and renewable power infrastructure.
With Colombo Port expanding digital automation and Hambantota developing specialized maritime logistics, demand for ruggedized sensor nodes, asset-tracking transceivers, and marine-grade telematics has escalated dramatically. Reliable PCBA designs capable of resisting saline environments and moisture are mission-critical.
Sri Lanka's world-class apparel export industry is undertaking deep Industry 4.0 retrofits. Smart textile sensing, automated fabric defect vision engines, and embedded telemetry modules require multi-layer HDI PCBA boards that deliver low failure rates under high factory heat and continuous vibration cycles.
As the Ceylon Electricity Board (CEB) and independent power producers push for accelerated solar micro-inverter and smart metering coverage, there is rising procurement pressure for power electronics featuring high-voltage isolation, conformal coating, and Class 3 solder integrity.
Designing and manufacturing electronic hardware for equatorial, coastal South Asian markets demands tailored engineering safeguards against extreme ambient moisture, voltage spikes, and salt-mist corrosion.
Sri Lanka experiences average relative humidity levels ranging from 70% to 90%. We implement automated selective spray conformal coating (polyurethane, acrylic, and silicone chemistry) matching IPC-CC-830 standards to permanently eliminate dendritic growth and electrochemical migration.
Miniaturization of edge compute devices requires micro-via laser drilling, stacked vias, and 01005 passive placement. Our cleanrooms handle 0.3mm ultra-fine pitch Ball Grid Arrays (BGAs) with multi-angle 3D automated X-ray inspection (AXI) to identify hidden voids early.
For smart metering and logistics projects throughout Sri Lanka, we provide precision RF matching network optimization covering NB-IoT, LTE-M, LoRaWAN (868MHz / 433MHz), and BLE 5.3, complete with in-house spectrum analysis and automated functional testing (FCT).
Combining the dense component aggregation networks of Shenzhen with smart automated SMT production lines eliminates procurement friction and protects against global chip volatility.
Every Gerber and Bill of Materials (BOM) package submitted by our Sri Lankan clients undergoes closed-loop Design for Manufacturability (DFM) verification. We catch pin-out errors, footprint discrepancies, and end-of-life (EOL) semiconductors prior to stencil laser cutting.
With direct ties to tier-1 authorized distributors and verified wafer fabrication outlets, we provide 100% turnkey procurement, partial consignment, or alternate pin-compatible IC suggestions. Full CoC (Certificate of Conformance) files accompany every production lot.
Our 8 high-speed SMT lines deploy Koh Young 3D SPI (Solder Paste Inspection), dual-camera inline AOI, dynamic burn-in chambers, and custom functional testing (FCT) jigs built specifically to the customer's firmware and diagnostic requirements.
Direct communication with veteran SMT process engineers in Shenzhen. From BOM cost reductions to rapid prototype turnarounds and air cargo direct to Colombo (CMB).
Navigating Sri Lanka's Telecommunications Regulatory Commission (TRCSL) guidelines and Sri Lanka Standards Institution (SLSI) certifications requires precision documentation.
For telematics, GSM, and Wi-Fi equipment destined for Sri Lanka, our RF lab validates radiated power, harmonic suppression, and spurious emissions to smooth out TRCSL equipment type approvals.
Benefiting from direct air cargo routes from Shenzhen/Guangzhou/Hong Kong to Bandaranaike International Airport (CMB) and sea containers straight to Colombo Port, we assure fast transit times, vacuum anti-static packaging, and certified customs clearance paperwork.
Beyond PCBA, we offer complete system box-build assembly: ultrasonic plastic welding, precision CNC aluminum housings, silicone gasket IP67 potting, cable harness soldering, and custom retail packaging ready for shelf distribution in Sri Lanka.
Essential guidance on lead times, minimum order quantities, component traceability, and factory qualification.
High-mix manufacturing covering smart wearable integration, high-capacity power supplies, and customized build-to-print industrial control assemblies.