ODM PCBA Reverse Engineering Manufacturers & Service

Our comprehensive reverse engineering package provides full, production-ready engineering documentation: production Gerber files in RS-274X or IPC-2581 format, Excellon drill files, multi-sheet vector schematics in Altium Designer, OrCAD, or KiCad, an itemized Bill of Materials (BOM) with active manufacturer part numbers (MPNs) and vetted second sources, XY Pick-and-Place (centroid) coordinate files, internal stackup specifications with controlled impedance reports, and extracted binary/hex firmware images where contractually requested.

When component surface markings have been intentionally destroyed, our laboratory executes chemical acid decapsulation (nitric or sulfuric acid jet etching) to remove the epoxy package while leaving the silicon die intact. Under high-powered optical and electron microscopy, our engineers inspect the original die manufacturer logo, die layout part numbers, revision masks, and copyright dates, cross-referencing them against global semiconductor silicon databases to identify the true silicon origin.

Yes. Depending on the security tier of the target IC, we apply non-invasive side-channel analysis, power glitching, clock glitching, or invasive silicon micro-probing to bypass security lock bits. Once microcode is dumped, we run integrity checksums across multiple donor samples to verify that no flash data corruption occurred during reading.

For multi-layer boards exceeding 4 layers, we strongly recommend providing at least two physical samples: one designated for non-destructive reference verification and functional golden-board benchmarking, and one sacrificial board designated for mechanical de-soldering, chemical etching, and physical layer lapping. For simple 1- to 2-layer assemblies, a single intact board is often sufficient.

Simple 2- to 4-layer control boards are typically completed within 7 to 14 business days. High-density, multi-layer HDI boards (8 to 24 layers) with fine-pitch BGAs and embedded microvias take between 3 to 5 weeks. Pricing is calculated transparently based on layer count, component density (total pin count), presence of proprietary/encrypted chips, and whether modernized redesigns are requested.

Yield is secured via a strict closed loop: 100% incoming component inspection with MSD baking, 3D SPI paste volume measurement, automated SMT placement, zoned reflow with board-specific thermal profiling, 3D AOI, automated X-Ray for BGA joint voids (<15%), and custom bed-of-nails Functional Circuit Testing (FCT). Our facility consistently maintains a first-pass yield above 98.5% across production lots.