Production Portfolio
Featured Turnkey Assemblies & Precision Products
Seamless execution from customer Gerber files and BOM through advanced automated surface-mount assembly.
Seamless execution from customer Gerber files and BOM through advanced automated surface-mount assembly.
Addressing thermal dissipation, signal integrity, and micro-mechanical tolerances for next-generation compute modules.
High Density Interconnect (HDI) PCBs represent the zenith of PCB layout compaction, integrating blind, buried, and staggered/stacked microvias with line widths and spaces under 50μm. Our production facility employs advanced UV and CO2 laser drilling systems to create microvias as small as 0.075mm, followed by copper electroplating for Via-in-Pad Plated Over (VIPPO) structures.
This enables ultra-dense routing under 0.35mm pitch fine-pitch ball grid arrays (FBGA), eliminating signal stubs, decreasing parasitic inductance, and significantly boosting RF and high-speed digital performance.
| HDI Engineering Parameter | Standard Capability | Advanced / Custom Limit |
|---|---|---|
| Layer Count Range | 4 - 18 Layers | Up to 32 Layers (Any-Layer ELIC) |
| Laser Microvia Diameter | 0.10 mm (4 mil) | 0.075 mm (3 mil) |
| Min Line Width / Space (Inner/Outer) | 3.0 / 3.0 mil (75μm) | 1.8 / 1.8 mil (45μm) |
| Microvia Aspect Ratio | 0.8:1 | 1:1 Stacked Copper Filled |
| Component Density Support | 0201 Passives / 0.4mm BGA | 01005 Passives / 0.3mm Pitch BGA |
Polar SI9000-calculated stack-ups supporting single-ended (50Ω) and differential pairs (90/100Ω) within tight ±5% tolerances for PCIe 5.0 and DDR5 routing.
Processing Rogers, Panasonic Megtron 6/7, Isola, and Shengyi high-Tg/low-loss laminates (Df < 0.003, Dk < 3.6) engineered for stable mmWave and microwave operation.
Direct thermal vias plugged and copper plated underneath power management ICs and power stages to mitigate hotspot concentrations in ultra-thin enclosures.
Anticipating the convergence of Substrate-Like PCB (SLP), heterogeneous packaging, and embedded die technology.
Transitioning from subtractive etching to modified Semi-Additive Process (mSAP). Enables line/space widths down to 25/25μm, doubling component layout density for AI wearables and edge computing peripherals.
Direct cavity lamination integrating silicon chips, capacitors, and inductors inside the inner layers. Drastically slashes board area, eliminates loop inductance, and unlocks unprecedented power delivery integrity.
Pioneering PTFE ceramic compounds and liquid crystal polymer (LCP) flexible/rigid-flex hybrid HDI boards. Optimized for ultra-low dissipation factor at sub-terahertz frequencies.
Mission-critical electronics engineered to operate faultlessly across extreme temperatures, mechanical shocks, and vibration.
ASIL-D compliant manufacturing for Battery Management Systems (BMS), ADAS radar lidar boards, and motor drive controllers. Fully verified through thermal cycling (-40°C to +150°C).
High-reliability SMT for portable patient telemetry, imaging devices, endoscopy processors, and point-of-care analyzers where fail-safe operation is legally mandated.
100GbE / 400GbE switch fabrics, optical transceiver modules, and AI inference accelerators operating in dense data centers and harsh industrial field deployments.
How physical proximity to the world's dense component cluster compresses lead times and mitigates global component volatility.
Proximity to Huaqiangbei and authorized semiconductor distributors allows immediate sourcing of passives, discrete parts, and hard-to-find active silicon.
SMT process specialists evaluate Gerber packages and BOM part numbers immediately to detect component footprint mismatches prior to stencil laser cutting.
Integrated 3D SPI (Solder Paste Inspection), automated inline 3D AOI, high-magnification oblique X-ray, and functional circuit burn-in testing.
Dedicated bilingual engineering PMs supporting hardware teams throughout North America, Europe, and Australasia across overlapping business hours.
Eliminating supply chain vulnerability through dual-sourcing validation, component authentication, and standardized export documentation.
Full conformance to RoHS 3 (EU 2015/863), REACH, and Conflict Minerals rules. Comprehensive material declaration data provided upfront for smooth customs clearance and environmental auditing.
100% factory-sealed reel verification through tier-1 franchised distributors. Component authenticity verified with decapsulation, microscopic marking checks, and incoming electrical characterization.
DAP / DDP logistics arrangements, customized protective vacuum-ESD packaging, and expedited worldwide air transit (DHL, FedEx, UPS) directly to OEM fulfillment warehouses.
Direct technical answers addressing DFM rules, lead times, panelization, and prototyping economics.
Explore our integrated turnkey capabilities across consumer smart devices, industrial automation, and power boards.
